Physical Design for 3D Integrated Circuits Hardback
Edited by Aida (CNRS-LIRMM/University of Montpellier, France) Todri-Sanial, Chuan Seng (Nanyang Technological University, Singapore) Tan
Part of the Devices, Circuits, and Systems series
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs).
It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic.
This comprehensive reference:Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICsSupplies state-of-the-art solutions for challenges unique to 3D circuit designFeatures contributions from renowned experts in their respective fieldsPhysical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
- Format: Hardback
- Pages: 397 pages, 78; 39 Tables, black and white; 24 Illustrations, color; 215 Illustrations, black and whi
- Publisher: Taylor & Francis Inc
- Publication Date: 24/11/2015
- Category: Circuits & components
- ISBN: 9781498710367