Microelectronics Failure Analysis Desk Reference, Mixed media product Book

Microelectronics Failure Analysis Desk Reference Mixed media product


This updated reference book, prepared by experts in their fields, contains dozens of articles covering a wide range of topics involving the failure analysis of microelectronics.

It places the most important and up-to-date information on this subject at your fingertips.

Topic coverage includes: * Failure Analysis Process Flow * Failure Verification * Failure Modes and Failure Classification * Special Devices (MEMS, Optoelectronics, Passives) * Fault Localisation Techniques: Package Level (NDT) * Die Level (Depackaging, Photon Emission, Microthermography, Laser-Based Methods, Particle Beam Methods) * Deprocessing & Imaging Techniques: Deprocessing * General Imaging Techniques * Local Deprocessing & Imaging * Circuit Edit and Design Modification * Material Analysis Techniques * Reference Information: Important Topics for Semiconductor Devices * Failure Analysis Techniques Roadmap * Failure Analysis Operations and Management * Appendices: Failure Analysis Terms, Definitions, and Acronyms * Industry Standards


  • Format: Mixed media product
  • Pages: 800 pages
  • Publisher: ASM International
  • Publication Date:
  • Category: Electronics engineering
  • ISBN: 9781615037254


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