Solder Materials Hardback
by Kwang-lung (Nat'l Cheng Kung Univ, Taiwan) Lin
Part of the Wspc Series In Advanced Integration And Packaging series
Hardback
Description
This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint.
The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures.
It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications.
This book is an important resource for the various important subjects relating to solder materials.
Information
-
Available to Order - This title is available to order, with delivery expected within 2 weeks
- Format:Hardback
- Pages:388 pages
- Publisher:World Scientific Publishing Co Pte Ltd
- Publication Date:05/09/2018
- Category:
- ISBN:9789813237605
Information
-
Available to Order - This title is available to order, with delivery expected within 2 weeks
- Format:Hardback
- Pages:388 pages
- Publisher:World Scientific Publishing Co Pte Ltd
- Publication Date:05/09/2018
- Category:
- ISBN:9789813237605
