3D IC & RF SIPS, Hardback Book

3D IC & RF SIPS Hardback

Part of the WILEY IEEE series


Advanced Stacking and Planar Solutions for 5G Mobility.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments


Other Formats



Free Home Delivery

on all orders

Pick up orders

from local bookshops