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Low-K Nanoporous Interdielectrics : Materials, Thin Film Fabrications, Structures & Properties, Paperback / softback Book

Low-K Nanoporous Interdielectrics : Materials, Thin Film Fabrications, Structures & Properties Paperback / softback

Paperback / softback

Out of stock

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The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs.

One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics.

This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.

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