Characterization Of Integrated Circuit Packaging Materials Hardback
by Thomas M. Moore, Robert G. Mckenna
Hardback
Description
With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stress, moisture sensitivity, solderability of IC components, and interconnect systems.
Readers will find:General overview of IC package reliability testingCharacterization for the electrical performance of IC packagesUnderstanding surface characteristics and interfaces for thermal managementConcise summaries of major characterization technologies for integrated circuit packaging materials, including acoustic microscopy, atomic absorption spectrometry, Auger Electron Spectroscopy, Energy-Dispersive X-Ray Spectroscopy, and many more
Information
-
Out of stock
- Format:Hardback
- Pages:274 pages, Illustrations
- Publisher:Momentum Press
- Publication Date:16/04/2010
- Category:
- ISBN:9781606501870
Information
-
Out of stock
- Format:Hardback
- Pages:274 pages, Illustrations
- Publisher:Momentum Press
- Publication Date:16/04/2010
- Category:
- ISBN:9781606501870
