Chemical-Mechanical Planarization: Volume 767 Hardback
Edited by Duane S. (Massachusetts Institute of Technology) Boning, Katia Devriendt, Michael R. Oliver, David J. Stein, Ingrid Vos
Part of the MRS Proceedings series
Hardback
Description
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding.
New slurries and consumables are under development. New applications to novel devices continue to appear.
This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome.
Presentations from academia, government labs and industry are featured.
Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
Information
-
Item not Available
- Format:Hardback
- Pages:348 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:27/08/2003
- Category:
- ISBN:9781558997042
Information
-
Item not Available
- Format:Hardback
- Pages:348 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:27/08/2003
- Category:
- ISBN:9781558997042
