Advanced Metallization Conference 2002 (AMC 2002): Volume 18 Hardback
Edited by Bradley M. Melnick, Timothy S. (Rensselaer Polytechnic Institute, New York) Cale, Shigeaki (Nagoya University, Japan) Zaima, Tomohiro Ohta
Part of the MRS Conference Proceedings series
Hardback
Description
Leading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials.
Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects.
For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration.
Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies.
Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.
Information
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Item not Available
- Format:Hardback
- Pages:882 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2003
- Category:
- ISBN:9781558997196
Information
-
Item not Available
- Format:Hardback
- Pages:882 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2003
- Category:
- ISBN:9781558997196
