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Advances in Cryogenic Engineering, Paperback / softback Book

Advances in Cryogenic Engineering Paperback / softback

Edited by K. Timmerhaus

Part of the Advances in Cryogenic Engineering series

Paperback / softback

Description

The Second International Cryogenic Materials Conference (ICMC) was held in Boulder, Colorado, in conjunction with the 1977 Cryogenic Engineering Con­ ference (CEC).

Special thanks must be given to the University of Colorado for their skillful hosting of these two conferences.

Collaboration between the two con­ ferences has been mutually beneficial, providing the materials special ist with insight into new applications and design concepts and the cryogenic engineer with exposure to modern materials accomplishments and potentials.

The Proceedings of the 1977 Cryogenic Engineering Conference are published in Volume 23 of Advances in Cryogenic Engineering.

Both conferences will be held again simul­ taneously in Madison, Wisconsin, in August 1979.

The success and growth of the two International Cryogenic Materials Con­ ferences have led to the formation of an ICMC Board of Directors.

The board members will serve a four-year term and include: Chairman, R.

P. Reed (U.S.), R. W. Boom (U.S.), A. F. Clark (U.S.), G. Hartwig (W. Germany), J. W. Morris (U.S.), M. Suenaga (U.S.), K. Tachikawa (Japan), J. Tanaka (Japan), and K. A. Yushchenko (USSR).

Information

  • Format:Paperback / softback
  • Pages:586 pages, 80 Illustrations, black and white; XII, 586 p. 80 illus.
  • Publisher:Springer-Verlag New York Inc.
  • Publication Date:
  • Category:
  • ISBN:9781461398554

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Information

  • Format:Paperback / softback
  • Pages:586 pages, 80 Illustrations, black and white; XII, 586 p. 80 illus.
  • Publisher:Springer-Verlag New York Inc.
  • Publication Date:
  • Category:
  • ISBN:9781461398554