Advanced Metallization Conference 1999 (AMC 1999): Volume 15 Hardback
Edited by Mihal E. Gross, Thomas Gessner, N. Kobayashi, Y. (Nagoya University, Japan) Yasuda
Part of the MRS Conference Proceedings series
Hardback
Description
The revolution in materials and processes for IC metallization presents exciting challenges for the future.
This book, the 16th in a popular series from MRS, provides a forum within the IC metallization community, across industrial, academic and government institutions, for presentation and discussion of leading-edge research, development and technology.
In particular, the volume focuses on Cu and low-k dielectrics spanning materials, properties, processing, integration and reliability.
Two keynote addresses are featured - one on 'The MARCO/DARPA Interconnect Focus Cente' a cooperative research program involving several top universities in the U.S. whose mission it is to explore new interconnect strategies for the future, the other on 'Low-Cost and High-Performance DRAM Technology'.
Additional topics include: integration of damascene architectures; copper-deposition processes and properties; barriers for copper; low-k dielectrics; aluminum, tungsten and DRAM metallization; silicides; CMP/cleaning/etching; process modeling and reliability.
Information
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Item not Available
- Format:Hardback
- Pages:763 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2000
- Category:
- ISBN:9781558995390
Information
-
Item not Available
- Format:Hardback
- Pages:763 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2000
- Category:
- ISBN:9781558995390
