Adhesion Aspects in MEMS/NEMS Paperback / softback
Edited by Seong H. Kim, Michael T. Dugger, Kash L. Mittal
Paperback / softback
Description
Phenomena associated with the adhesion interaction of surfaces have been a critical aspect of micro- and nanosystem development and performance since the first MicroElectroMechanicalSystems(MEMS) were fabricated.
These phenomena are ubiquitous in nature and are present in all systems, however MEMS devices are particularly sensitive to their effects owing to their small size and limited actuation force that can be generated.
Extension of MEMS technology concepts to the nanoscale and development of NanoElectroMechanicalSystems(NEMS) will result in systems even more strongly influenced by surface forces. The book is divided into five parts as follows: Part 1: Understanding Through Continuum Theory; Part 2: Computer Simulation of Interfaces; Part 3: Adhesion and Friction Measurements; Part 4: Adhesion in Practical Applications; andPart 5: Adhesion Mitigation Strategies. This compilation constitutes the first book on this extremely important topic in the burgeoning field of MEMS/NEMS.
It is obvious from the topics covered in this book that bountiful information is contained here covering understanding of surface forces and adhesion as well as novel ways to mitigate adhesion in MEMS/NEMS. This book should be of great interest to anyone engaged in the wonderful and fascinating field of MEMS/NEMS, as it captures the current R&D activity.
Information
-
Out of stock
- Format:Paperback / softback
- Pages:410 pages
- Publisher:Taylor & Francis Ltd
- Publication Date:09/12/2019
- Category:
- ISBN:9780367445942
Information
-
Out of stock
- Format:Paperback / softback
- Pages:410 pages
- Publisher:Taylor & Francis Ltd
- Publication Date:09/12/2019
- Category:
- ISBN:9780367445942
