Advanced Metallization Conference 2006 (AMC 2006): Volume 22 Hardback
Edited by Stephen W. Russell, Michael E. Mills, Akihiko Osaki, Takashi Yoda
Part of the MRS Conference Proceedings series
Hardback
Description
The Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects.
Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved.
Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.
Information
-
Out of stock
- Format:Hardback
- Pages:715 pages, Illustrations
- Publisher:Materials Research Society
- Publication Date:01/01/2007
- Category:
- ISBN:9781558999473
Information
-
Out of stock
- Format:Hardback
- Pages:715 pages, Illustrations
- Publisher:Materials Research Society
- Publication Date:01/01/2007
- Category:
- ISBN:9781558999473
