Electronic Packaging Materials Science X: Volume 515 Hardback
Edited by Daniel J. Belton, Michael Gaynes, Elizabeth G. Jacobs, Raymond (Lehigh University, Pennsylvania) Pearson, Tien Wu
Part of the MRS Proceedings series
Hardback
Description
Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability.
In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability.
This book explores the questions of materials, processes and reliability for high-density package solutions.
The book is strengthened by invited and contributed papers from a host of national and international experts.
Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.
Information
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Item not Available
- Format:Hardback
- Pages:262 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/10/1998
- Category:
- ISBN:9781558994218
Information
-
Item not Available
- Format:Hardback
- Pages:262 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/10/1998
- Category:
- ISBN:9781558994218
