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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019), Paperback / softback Book

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019) Paperback / softback

Paperback / softback

Only a few left - usually despatched within 24 hours

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Printed collection of 90 full-length, peer-reviewed technical papers.

Topics include:Autonomous, Hybrid, and Electric VehiclesEnergy Conversion and StorageFlexible and Wearable ElectronicsHeterogeneous IntegrationInternet of ThingsPhotonics and OpticsPower ElectronicsServers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions andService to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Coolingof Server Systems

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£263.00

Only a few left - usually despatched within 24 hours
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