3D Integration for VLSI Systems PDF
Edited by Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester
Description
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits.
Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th
Information
-
Download - Immediately Available
- Format:PDF
- Pages:350 pages
- Publisher:Pan Stanford Publishing Pte Ltd
- Publication Date:19/04/2016
- Category:
- ISBN:9789814303828
Information
-
Download - Immediately Available
- Format:PDF
- Pages:350 pages
- Publisher:Pan Stanford Publishing Pte Ltd
- Publication Date:19/04/2016
- Category:
- ISBN:9789814303828