Advanced Flip Chip Packaging Hardback
Edited by Ho-Ming Tong, Yi-Shao Lai, C.P. Wong
Hardback
Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Information
-
Out of stock
- Format:Hardback
- Pages:560 pages, VII, 560 p.
- Publisher:Springer-Verlag New York Inc.
- Publication Date:21/03/2013
- Category:
- ISBN:9781441957672
Information
-
Out of stock
- Format:Hardback
- Pages:560 pages, VII, 560 p.
- Publisher:Springer-Verlag New York Inc.
- Publication Date:21/03/2013
- Category:
- ISBN:9781441957672