Materials Reliability Issues in Microelectronics: Volume 225 Hardback
Edited by James R. Lloyd, Frederick G. Yost, Paul S. (IBM T J Watson Research Center, New York) Ho
Part of the MRS Proceedings series
Hardback
Description
With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools.
This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation.
Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
Information
-
Out of stock
- Format:Hardback
- Pages:382 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:22/10/1991
- Category:
- ISBN:9781558991194
Information
-
Out of stock
- Format:Hardback
- Pages:382 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:22/10/1991
- Category:
- ISBN:9781558991194
