Three-Dimensional Integration and Modeling : A Revolution in RF and Wireless Packaging Paperback / softback
by Jong-Hoon Lee, Manos M. Tentzeris
Part of the Synthesis Lectures on Computational Electromagnetics series
Paperback / softback
Description
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
Information
-
Item not Available
- Format:Paperback / softback
- Pages:108 pages
- Publisher:Morgan & Claypool Publishers
- Publication Date:01/11/2007
- Category:
- ISBN:9781598292442
Other Formats
- Paperback / softback from £27.99
- PDF from £23.79
Information
-
Item not Available
- Format:Paperback / softback
- Pages:108 pages
- Publisher:Morgan & Claypool Publishers
- Publication Date:01/11/2007
- Category:
- ISBN:9781598292442