Please note: In order to keep Hive up to date and provide users with the best features, we are no longer able to fully support Internet Explorer. The site is still available to you, however some sections of the site may appear broken. We would encourage you to move to a more modern browser like Firefox, Edge or Chrome in order to experience the site fully.

Supporting your high street Find out how »
Area Array Packaging Handbook: Manufacturing and Assembly, PDF eBook

Area Array Packaging Handbook: Manufacturing and Assembly PDF

PDF

Download - Immediately Available
Please note: eBooks can only be purchased with a UK issued credit card and all our eBooks (ePub and PDF) are DRM protected.

Description

*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Information

Save 30%

£117.90

£82.53

Download - Immediately Available
Add to Basket
Sign in to add to wishlist
 
Delivered to your inbox

to transfer to your device

eBook Help

Is this the right eBook for
my device? How do I download
this eBook? See help and FAQs pages

Information