MEMS/MOEM Packaging : Concepts, Designs, Materials and Processes PDF
by Ken Gilleo
Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Information
-
Download - Immediately Available
- Format:PDF
- Pages:220 pages
- Publisher:McGraw Hill LLC
- Publication Date:01/08/2005
- Category:
- ISBN:9780071589093
Information
-
Download - Immediately Available
- Format:PDF
- Pages:220 pages
- Publisher:McGraw Hill LLC
- Publication Date:01/08/2005
- Category:
- ISBN:9780071589093