RF and Microwave Microelectronics Packaging Paperback / softback
Edited by Ken Kuang, Franklin Kim, Sean S. Cahill
Paperback / softback
Description
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics.
It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.
It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Information
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Item not Available
- Format:Paperback / softback
- Pages:285 pages, 15 Tables, black and white; XVI, 285 p.
- Publisher:Springer-Verlag New York Inc.
- Publication Date:05/09/2014
- Category:
- ISBN:9781489983244
Information
-
Item not Available
- Format:Paperback / softback
- Pages:285 pages, 15 Tables, black and white; XVI, 285 p.
- Publisher:Springer-Verlag New York Inc.
- Publication Date:05/09/2014
- Category:
- ISBN:9781489983244
