3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility PDF
by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng
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Description
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments
- Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
- Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft s Excel and Minitab
- Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
- Provides chapter-wise review questions and powerpoint slides as teaching tools
Information
-
Download - Immediately Available
- Format:PDF
- Publisher:Wiley
- Publication Date:28/03/2018
- Category:
- ISBN:9781119289678
Other Formats
- Hardback from £115.95
- EPUB from £98.56
Information
-
Download - Immediately Available
- Format:PDF
- Publisher:Wiley
- Publication Date:28/03/2018
- Category:
- ISBN:9781119289678