Low Dielectric Constant Materials for IC Applications Paperback / softback
Edited by Paul S. Ho, Jihperng Leu, Wei William Lee
Part of the Springer Series in Advanced Microelectronics series
Paperback / softback
Description
Low dielectric constant materials are an important component of microelectronic devices.
This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics.
Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology.
Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability.
This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.
Information
-
Item not Available
- Format:Paperback / softback
- Pages:310 pages, XIX, 310 p.
- Publisher:Springer-Verlag Berlin and Heidelberg GmbH & Co. K
- Publication Date:04/10/2012
- Category:
- ISBN:9783642632211
Information
-
Item not Available
- Format:Paperback / softback
- Pages:310 pages, XIX, 310 p.
- Publisher:Springer-Verlag Berlin and Heidelberg GmbH & Co. K
- Publication Date:04/10/2012
- Category:
- ISBN:9783642632211
