Testing of Interposer-Based 2.5D Integrated Circuits Hardback
by Ran Wang, Krishnendu Chakrabarty
Hardback
Description
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies.
Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.
Information
-
Item not Available
- Format:Hardback
- Pages:182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p
- Publisher:Springer International Publishing AG
- Publication Date:29/03/2017
- Category:
- ISBN:9783319547138
Other Formats
- Paperback / softback from £99.99
Information
-
Item not Available
- Format:Hardback
- Pages:182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p
- Publisher:Springer International Publishing AG
- Publication Date:29/03/2017
- Category:
- ISBN:9783319547138