Self-Organized 3D Integrated Optical Interconnects : with All-Photolithographic Heterogeneous Integration EPUB
by Tetsuzo Yoshimura
EPUB
Description
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects.
For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology.
OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order†and “large line counts of hundreds-thousands.†This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts.
The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.
This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Information
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Download - Immediately Available
- Format:EPUB
- Pages:380 pages, 13 Tables, black and white; 28 Illustrations, color; 244 Illustrations, black and white
- Publisher:Pan Stanford Publishing Pte Ltd
- Publication Date:08/03/2021
- Category:
- ISBN:9781000064629
Other Formats
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Information
-
Download - Immediately Available
- Format:EPUB
- Pages:380 pages, 13 Tables, black and white; 28 Illustrations, color; 244 Illustrations, black and white
- Publisher:Pan Stanford Publishing Pte Ltd
- Publication Date:08/03/2021
- Category:
- ISBN:9781000064629
