Packaging of High Power Semiconductor Lasers Hardback
by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
Part of the Micro- and Opto-Electronic Materials, Structures, and Systems series
Hardback
Description
This book introduces high power semiconductor laser packaging design.
The challenges of the design and various packaging and testing techniques are detailed by the authors.
New technologies and current applications are described in detail.
Information
-
Out of stock
- Format:Hardback
- Pages:402 pages, 386 Illustrations, color; 111 Illustrations, black and white; XV, 402 p. 497 illus., 386
- Publisher:Springer-Verlag New York Inc.
- Publication Date:15/07/2014
- Category:
- ISBN:9781461492627
Other Formats
- Paperback / softback from £81.69
- PDF from £127.08
Information
-
Out of stock
- Format:Hardback
- Pages:402 pages, 386 Illustrations, color; 111 Illustrations, black and white; XV, 402 p. 497 illus., 386
- Publisher:Springer-Verlag New York Inc.
- Publication Date:15/07/2014
- Category:
- ISBN:9781461492627