FinFET/GAA Modeling for IC Simulation and Design : Using the BSIM-CMG Standard Paperback / softback
by Yogesh Singh (Professor, Department of Electrical Engineering, Indian Institute of Technolo Chauhan, Chenming (Professor Emeritus, University of California, Berkeley, CA, USA) Hu, Girish (Assistant Professional Researcher, Department of Electrical Engineering and Computer Pahwa, Avirup (Assistant Professor, Dept. of Electronics and Communication Engineering, Indian In Dasgupta, Darsen (Associate Professor, Dept. of Electrical Engineering, National Cheng Kung University, Ta Lu, Sriramkumar (Skyworks Solutions, CA, USA) Vanugopalan, Sourabh (Associate Professor, Macquarie University, Sydney, Australia) Khandelwal, Juan Pablo (University of California, Berkeley, USA) Duarte, Navid (Device Engineer, Intel Corp., Oregon, USA) Payvadosi, Ali (Professor, EECS Department, UC Berkeley, USA) Niknejad
Paperback / softback
Description
FinFET/GAA Modeling for IC Simulation and Design: Using the BSIM-CMG Standard, Second Edition is the first to book to explain FinFET modeling for IC simulation and the industry standard – BSIM-CMG - describing the rush in demand for advancing the technology from planar to 3D architecture as now enabled by the approved industry standard.
The book gives a strong foundation on the physics and operation of FinFET, details aspects of the BSIM-CMG model such as surface potential, charge and current calculations, and includes a dedicated chapter on parameter extraction procedures, thus providing a step-by-step approach for the efficient extraction of model parameters. With this book, users will learn Why you should use FinFET, The physics and operation of FinFET Details of the FinFET standard model (BSIM-CMG), Parameter extraction in BSIM-CMG FinFET circuit design and simulation, and more.
Information
-
Pre-Order
- Format:Paperback / softback
- Pages:352 pages
- Publisher:Elsevier Science & Technology
- Publication Date:01/05/2024
- Category:
- ISBN:9780323957298
Information
-
Pre-Order
- Format:Paperback / softback
- Pages:352 pages
- Publisher:Elsevier Science & Technology
- Publication Date:01/05/2024
- Category:
- ISBN:9780323957298
