Hybrid Assemblies and Multichip Modules Hardback
by Kear
Part of the Manufacturing Engineering and Materials Processing series
Hardback
Description
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Information
-
Out of stock
- Format:Hardback
- Pages:296 pages
- Publisher:Taylor & Francis Inc
- Publication Date:16/12/1992
- Category:
- ISBN:9780824784669
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Information
-
Out of stock
- Format:Hardback
- Pages:296 pages
- Publisher:Taylor & Francis Inc
- Publication Date:16/12/1992
- Category:
- ISBN:9780824784669
