Advanced Metallization Conference 2005 (AMC 2005): Volume 21 Hardback
Edited by Sywert H. Brongersma, Thomas C. Taylor, Manabu Tsujimura, Kazuya Masu
Part of the MRS Conference Proceedings series
Hardback
Description
Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved.
Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.
Information
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Out of stock
- Format:Hardback
- Pages:782 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2006
- Category:
- ISBN:9781558998650
Information
-
Out of stock
- Format:Hardback
- Pages:782 pages, Worked examples or Exercises
- Publisher:Materials Research Society
- Publication Date:01/01/2006
- Category:
- ISBN:9781558998650
