Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Paperback / softback
by Jie Cheng
Part of the Springer Theses series
Paperback / softback
Description
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.
Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry.
The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives.
The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Information
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Out of stock
- Format:Paperback / softback
- Pages:137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.
- Publisher:Springer Verlag, Singapore
- Publication Date:30/01/2019
- Category:
- ISBN:9789811355851
Information
-
Out of stock
- Format:Paperback / softback
- Pages:137 pages, 103 Illustrations, black and white; XVIII, 137 p. 103 illus.
- Publisher:Springer Verlag, Singapore
- Publication Date:30/01/2019
- Category:
- ISBN:9789811355851
