Advances in Condition Monitoring and Structural Health Monitoring : WCCM 2019 Paperback / softback
Edited by Len Gelman, Nadine Martin, Andrew A. Malcolm, Chin Kian (Edmund) Liew
Part of the Lecture Notes in Mechanical Engineering series
Paperback / softback
Description
This book comprises the selected contributions from the 2nd World Congress on Condition Monitoring (WCCM 2019), held in Singapore in December 2019.
The contents focus on digitalisation for condition monitoring with the emergence of the fourth industrial revolution (Industry 4.0) and the Industrial Internet-of-Things (IIoT).
The book covers latest research findings in the areas of condition monitoring, structural health monitoring, and non-destructive testing which are relevant for many sectors including aerospace, automotive, civil, oil and gas, marine, and manufacturing industries.
Different monitoring systems and non-destructive testing methods are discussed to avoid failures, increase lifespans, and reduce maintenance costs of equipment and machinery.
The broad scope of the contents will make this book interesting for academics and professionals working in the areas of non-destructive evaluation and condition monitoring.
Information
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Out of stock
- Format:Paperback / softback
- Pages:795 pages, 415 Illustrations, color; 89 Illustrations, black and white; XV, 795 p. 504 illus., 415 i
- Publisher:Springer Verlag, Singapore
- Publication Date:03/02/2021
- Category:
- ISBN:9789811591983
Information
-
Out of stock
- Format:Paperback / softback
- Pages:795 pages, 415 Illustrations, color; 89 Illustrations, black and white; XV, 795 p. 504 illus., 415 i
- Publisher:Springer Verlag, Singapore
- Publication Date:03/02/2021
- Category:
- ISBN:9789811591983
