Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
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Format: Book (Hardback)
£140.00
Available to Order - This title is available to order, with delivery expected within 2 weeks
Book (Hardback)
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Xing-Chang Wei
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Xing-Chang Wei
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Format: eBook (PDF)