Low-K Nanoporous Interdielectrics : Materials, Thin Film Fabrications, Structures & Properties Paperback / softback
by Moonhor Ree, Jinhwan Yoon, Kyuyoung Heo
Paperback / softback
Description
The use of low dielectric constant (low-k) interdielectrics in multilevel structure integrated circuits (ICs) can lower line-to-line noise in interconnects and alleviate power dissipation issues by reducing the capacitance between the interconnect conductor lines. Because of these merits, low-k interdielectric materials are currently in high demand in the development of advanced ICs.
One important approach to obtaining low-k values is the incorporation of nanopores into dielectrics.
This book provides an overview of the methodologies and characterisation techniques used for investigating low-k nanoporous interdielectrics.
Information
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Out of stock
- Format:Paperback / softback
- Pages:67 pages, Illustrations, unspecified
- Publisher:Nova Science Publishers Inc
- Publication Date:19/03/2011
- Category:
- ISBN:9781616687496
Information
-
Out of stock
- Format:Paperback / softback
- Pages:67 pages, Illustrations, unspecified
- Publisher:Nova Science Publishers Inc
- Publication Date:19/03/2011
- Category:
- ISBN:9781616687496